These are PCBs that enable free connection between all layers combining laser technology and filled plating technology that allows ultra-fine processing. With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high performance devices.
These support the EMS business
Features
AnyLayer PCBs with Laser Via and Filled Plating on each layer
Thinner 0.4mm pitch CSP by AnyLayer interconnection supported
Mass-production of 10-layer M-VIA Ⅲ (AnyLayer PCBs) for mobile devices
Applications
Cross section
Stackup
Design rule
