PCB
GLOBAL SUCCESS has advanced technology capabilities after introduced world-class PCB production equipments & high precision test equipments and applied scientific management mode. Now GLOBALSUCCESS is capable for producing PCB from Single layers to 32 layers with smallest hole diameter 0.10mm, min line width/space 0.075mm, 0.40mm BGA pitch and has the special technology to produce Selective ENIG/Depth control routing/Semi hole/ Hybid High-Frequency Multilayer PCB.
Our Manufacturing Capabilities:
Rigid PCB
FPC & Flex-rigid
Layers
1~32
Laminate
Normal Tg / High Tg / Lead free / Halogen Free
(Brands: Shengyi, Rogers, Hitachi, Kingboard, ITEQ)
Surface Finishing
OSP/HASL/ENIG/LF HASL/Flash Gold
Immersion TIN/Immersion Silver
Board Thickness
0.15~3.2mm (Min.--Max.)
4~8mil (Inner Core)
Copper Thickness
1/3~1oz
Min. L.W/L.S
0.0635mm (inner)
0.0635mm (outer)
HDI stack up
1+N+1, 2+N+2, 3+N+3 (with copper filling)
Material
Polyimide
Taiflex
Shengyi
Layers
1~6
Final board thickness
0.05~0.6mm
Copper Thickness
1/3~3oz
Min. L.W/L.S
1.6/1.6mil (inner)
1.6/1.6mil (external)
Min. drill bit size
6mil
Impedance Control
+/- 10% (single ended)
+/- 10% (differential)
Rigid PCB
Layers
1~4
Base Material
Aluminum(Larid, Ventec, Boyu), Iron and Copper isolation base
Max. Dimension
Length 1500mm,Width 500mm
Copper Foil Thickness
0.5~10oz
Dielectric Thickness
0.075~0.15mm
Aluminum Laminate Thickness
0.5~3.2mm
Min. L.W & Distance
0.15/0.12mm (copper thickness 1oz)
0.18/0.15mm (copper thickness 2oz)
0.25/0.20mm (copper thickness 3oz)
0.30/0.35mm (copper thickness 4oz)
Impedance Control
+/-10%
HDI stack up
1+N+Al,
Our product photo
